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Rajiekart 1g GD900 The Best Thermal Paste Grease Heat Sink Compound for CPU and Chip-Sets.


  1. The Best Thermal Paste Grease Heat Sink Compound for CPU and Chip-Sets.
  2. Thermal Conductivity: > 4.8 W/M-K
  3. Weight: Approx. 1 g
  • Apply to RoHS environmental protection requirements.
  • High thermal conductivity, effective insulation, high-temperature resistance, low oil departs non-corrosive.
  • Working principle: Fill the gap between the heating element and the cooling device; Increase the contact area, so as to achieve the soundest effect of thermal conductivity.
  • Method of use: It’s normal phenomena, there is a little silicone oil floating above.
  • Please stir well before use. Keep be painted surface clean, and painted directly with tools (such as a syringe, scraper, finger cot, etc.)

49.00399.00

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  • The Best Thermal Paste Grease Heat Sink Compound for CPU and Chip-Sets.

  • Thermal Conductivity: > 4.8 W/M-K, Weight: Approx. 1 g.:; Color : Grey.

  •  GD900 the best thermal paste selects much tinier particle diameter metal oxide as the main raw materials, for filling the gap between the heat source and heat sink device.

  •  Its outstanding performance on the CPU, GPU will meet your high standard demand for the cooling system. It is generally used as a thermal coupling of electrical/electronic devices to heat sinks such as base or mounting studs of transistors, diodes, and rectifiers.
  •  It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical/electronic component/device to the heat sink or chassis, thereby increasing the overall efficiency of the component/device.
  •  High Thermal Conductivity Low and Thermal Resistance. Electrically Non-Conductive Non-Curing Non-Capacitive Non-Corrosive Bleed resistant Temp resistant
  •  GD900 The best thermal paste selects much tinier particle diameter metal oxide as the main raw materials, for filling the gap between the heat source and heat sink device.
  • ★ Its outstanding performance on the CPU, GPU will meet your high standard demand for the cooling system.
  • ★ It is generally used as a thermal coupling of electrical/electronic devices to heat sinks such as base or mounting studs of transistors, diodes, and rectifiers.
  • ★ It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical/electronic component/device to the heat sink or chassis, thereby increasing the overall efficiency of the component/device.
  • ★ High Thermal Conductivity Low and Thermal Resistance.
  • ★ Electrically Non-Conductive Non-Curing Non-Capacitive Non-Corrosive Bleed resistant Temp resistant
  • ★ Thermal Conductivity: 4.8 W/M-K
  • ★ Specific Gravity: 2.3★ Net Weight:1 Gram★ Thermal Conductivity:  4.8 W/M-K★ Weight: Approx. 1 g★ Color: Grey.

    ★Package Includes: 1 x Rajiekart 1g GD900 The Best Thermal Paste Grease

SKU: N/A Categories: ,
Weight 10 g
Quantity

1 Pcs, 10 Pcs, 50 Pcs

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